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NTMFS4933N
Power MOSFET
30 V, 210 A, Single N ? Channel, SO ? 8 FL
Features
? Low R DS(on) to Improve Conduction and Overall Efficiency
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
Applications
? OR ? ing FET, Power Load Switch, Motor Control
? Refer to Application Note AND8195/D for Mounting Information
End Products
? Server, UPS, Fault ? Tolerant Power Systems, Hot Swap
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
R DS(ON) MAX
1.2 m W @ 10 V
2.0 m W @ 4.5 V
D (5,6)
I D MAX
210 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
± 20
V
G (4)
Continuous Drain
Current R q JA
(Note 1)
T A = 25 ° C
T A = 100 ° C
I D
34
21.5
A
S (1,2,3)
S
4933N
AYWZZ
S
G
D
Power Dissipation
R q JA (Note 1)
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T C = 25 ° C
T C =100 ° C
T C = 25 ° C
P D
I D
P D
I D
P D
I D
P D
2.74
43
27
7.3
20
12.5
1.06
210
132
104
W
A
W
A
W
A
W
N ? CHANNEL MOSFET
MARKING
DIAGRAM
D
S
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
D
D
Pulsed Drain
Current
T A = 25 ° C, t p = 10 m s
I DM
400
A
ORDERING INFORMATION
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source DV/DT
T J ,
T STG
I S
dV/d t
? 55 to
+150
95
4.4
° C
A
V/ns
Device
NTMFS4933NT1G
Package
SO ? 8 FL
(Pb ? Free)
Shipping ?
1500 /
Tape & Reel
Single Pulse Drain ? to ? Source Avalanche E AS 504 mJ
Energy (T J = 25 ° C, V DD = 24 V, V GS = 10 V,
I L = 58 A pk , L = 0.3 mH, R G = 25 W )
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
(Cu area = 50 mm 2 [1 oz])
NTMFS4933NT3G SO ? 8 FL 5000 /
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 8
1
Publication Order Number:
NTMFS4933N/D
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